With the increase in heat dissipation from microelectro […]
With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management becomes a more and more important element of electronic product design.
Both the performance reliability and life expectancy of electronic equipment are in the reaction related to the component temperature of the equipment.
The relationship between the reliability and the operating temperature of a typical silicon semiconductor device shows that a reduction in the temperature brought to an exponential increase in the reliability and life expectancy of the device.
Therefore, long life and reliable performance of a component may be achieved by effective controlling the device operating temperature within the limits set by the device design engineers.
Heat sinks are devices that condensation heat dissipation from a hot surface, usually the case of a heat generating component, to a cooler ambient, usually air
For the surrounding environment, the air is assumed to be the cooling fluid. In the most situations within the system, and the solid-air interface represents the greatest barrier for Heat dissipation.
A heat sink lowers this barrier about increasing the surface area that is in direct contact with the coolant
This allows more heat to be dissipated and / or lowers the device operating temperature.
The primary purpose of a heat sink is to maintain the device temperature below the maximum allowable temperature specified by the device manufacturer.http://www.gentwin.com/