Aluminum radiating fins This is the most common form of […]
Aluminum radiating fins
This is the most common form of heat dissipation, using aluminium fins as part of the shell to increase the heat dissipation area.
Thermal conductive plastic shell
Using LED insulation heat dissipation plastic instead of aluminum alloy to make heat dissipation body can greatly improve the thermal radiation capacity.
Surface Radiation Treatment
The surface of the lamp shell is treated with radiation heat dissipation, which is simply coated with radiation heat dissipation paint. The heat can be taken away from the surface of the lamp shell by radiation.
Using the shape of the lamp shell to produce convective air is the lowest cost way to enhance heat dissipation.
The interior of the lamp housing is strengthened by a long-lived and high-efficiency fan, which has low cost and good effect. However, changing fans is more troublesome and not suitable for outdoor use. This design is relatively rare.
Using heat pipe technology, heat is transferred from the LED chip to the shell heat dissipation fin. In large-scale lamps, such as street lamps, is a common design.
Liquid spherical bubbles
The transparent liquid with high thermal conductivity was filled into the bulb by using liquid bulb packaging technology. This is the only technology that uses LED chips to conduct heat and dissipate heat on the surface of light besides the principle of reflection.
Utilization of lamp holder
Low power LED lamps for home use often use the inner space of the lamp head to put the heating driving circuit in part or all. This can make use of a lamp head with a larger metal surface, such as a screw lamp head, to dissipate heat, because the lamp head is closely connected with the metal electrodes and power lines of the lamp holder. So part of the heat can be derived from this heat dissipation.
Application of Heat Conduction and Heat Dissipation
The purpose of heat dissipation of lamp housing is to reduce the working temperature of LED chips. Because the expansion coefficient of LED chips differs greatly from that of metal thermal conductivity and heat dissipation materials, it is impossible to weld the LED chips directly so as to avoid damage of the LED chips by high and low temperature thermal stress. The latest high thermal conductivity ceramic material, thermal conductivity close to aluminum, expansion system can be adjusted to synchronize with the LED chip. In this way, heat conduction and heat dissipation can be integrated, and the intermediate link of heat conduction can be reduced.