With the increase of heat dissipation of microelectroni […]
With the increase of heat dissipation of microelectronic devices, thermal management has been paid more and more attention in the design of electronic products. The performance and life expectancy of electronic equipment are often negatively correlated with the component temperature of the equipment. The relationship between the performance of a typical silicon semiconductor device and the operating temperature indicates that the decrease in temperature favors the device's performance and exponential growth in life expectancy.
Therefore, by effectively controlling the device operating temperature within the limits set by the device design engineer, the life of the device can be extended and performance improved.
A radiator is a device that enhances heat dissipation from a hot surface to a cooler environment. It is assumed that air is a cooling fluid. In most cases, heat transfer at the interface between the solid surface and the coolant air is the lead efficiency within the system, and the solid-air interface represents the biggest obstacle to heat dissipation.
The radiator mainly reduces the obstacle by increasing the surface area in direct contact with the coolant. This will increase the heat dissipated or reduce the device operating temperature. The main purpose of the radiator is to keep the device temperature below the maximum temperature specified by the device manufacturer.
The copper or aluminum metal is cast into the desired shape for use in conventional air-cooled electronic components. Solve low density heat problems with low cost. They are suitable for mass production, advanced tools and high-speed stamping will reduce costs.
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